Double-Sided Grinding Equipment for Superior Flat Surface Processing

Customization: Available
After-sales Service: One Year Warranty
Warranty: One Year Warranty

Product Description

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Basic Information

Model NO.
AT-61123
Application
Metal
Process Usage
Metal-Cutting CNC Machine Tools
Movement Method
Point to Point Control
Control Method
Semi-Closed Loop Control
Numerical Control
CNC/MNC
Processing Precision
0.01~0.02(mm)
Certification
ISO 9001
Condition
New
Origin
China

Application Areas

It is primarily used for high-precision double-sided grinding and polishing of sapphire, blue glass, ceramic sheets, crystals, semiconductors, and other hard and brittle materials.

Product Features

Precision Pressure ControlHigh-precision pressure closed-loop control is achieved through PLC + PT + electrical proportional valve + low-friction cylinder.
Upper Plate Shock Absorption DeviceA shock-absorbing elastic connection method suitable for both dynamic and static conditions.
Lower Plate SupportHigh-precision planar fluid bearing support.
Pin Gear TransmissionUsed for both inner and outer gears, extending the service life of the carrier and facilitating easy maintenance.
Upper and Lower Plate Water Cooling SystemAdopts a water-cooled structure for temperature control, enabling high-pressure processing.
Transmission SystemFour-motor synchronous drive, with adjustable speeds for the upper and lower plates, inner gear, outer gear (capable of both forward and reverse rotation), and featuring recipe functionality.
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Product Parameters

Item Specification Parameter
Lower PlateSize (Grinding)Φ1252mm × Φ708mm × 90mm
Lower PlateRotational Speed5-70 rpm
Upper PlateSize (Grinding)Φ1252mm × Φ708mm × 90mm
Upper PlateDrive Motor11kW AC380V 50Hz
Satellite GearQuantity9 pieces
Precision IndicatorsPlate Flatness≤0.02mm
Processing RangeMax SizeΦ280mm
Processing RangeMin Thickness0.20mm (≤2" wafer)
DimensionsL × W × H2100mm × 1600mm × 3013mm
WeightTotal WeightApproximately 7500Kg
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Scope of Operations

Our operations include technical services, technology development, and consulting across various fields. We specialize in the sales of functional glass, new optical materials, optical instruments, semiconductor device specialized equipment, and experimental analysis instruments. Our portfolio also includes CNC machine tools, electronic components, electromechanical equipment, metal cutting and welding equipment, and photovoltaic components.

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Detailed Photos

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Frequently Asked Questions

What materials can this equipment process?
The equipment is designed for high-precision grinding and polishing of hard and brittle materials, including sapphire, blue glass, ceramic sheets, crystals, and semiconductors.
What is the maximum pressure capacity of the upper plate?
The upper plate can reach a maximum pressure of 1000kg, controlled via a high-precision closed-loop system for consistent results.
How is the temperature managed during the grinding process?
Both the upper and lower plates feature an integrated water-cooling structure, allowing for efficient temperature control even during high-pressure processing.
What level of processing precision can be expected?
The machine offers exceptional precision, with plate flatness within ≤0.02mm and lower plate end jump within ≤0.03mm.
What are the power and air requirements for installation?
The system requires a 34kW AC380V 50Hz power supply (three-phase five-wire) and a compressed air source with a pressure of 0.5-0.6Mpa.

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