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It is primarily used for high-precision double-sided grinding and polishing of sapphire, blue glass, ceramic sheets, crystals, semiconductors, and other hard and brittle materials.
| Item | Specification | Parameter |
|---|---|---|
| Lower Plate | Size (Grinding) | Φ1252mm × Φ708mm × 90mm |
| Lower Plate | Rotational Speed | 5-70 rpm |
| Upper Plate | Size (Grinding) | Φ1252mm × Φ708mm × 90mm |
| Upper Plate | Drive Motor | 11kW AC380V 50Hz |
| Satellite Gear | Quantity | 9 pieces |
| Precision Indicators | Plate Flatness | ≤0.02mm |
| Processing Range | Max Size | Φ280mm |
| Processing Range | Min Thickness | 0.20mm (≤2" wafer) |
| Dimensions | L × W × H | 2100mm × 1600mm × 3013mm |
| Weight | Total Weight | Approximately 7500Kg |
Our operations include technical services, technology development, and consulting across various fields. We specialize in the sales of functional glass, new optical materials, optical instruments, semiconductor device specialized equipment, and experimental analysis instruments. Our portfolio also includes CNC machine tools, electronic components, electromechanical equipment, metal cutting and welding equipment, and photovoltaic components.




